Plastic package, semiconductor device, and method of manufacturi

Details Plastic package, semiconductor device, and method of manufacturi Plastic package, semiconductor device, and method of manufacturi

1998-03-25

2000-07-11

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257677, H01L 23495

Patent

active

060877138

ABSTRACT:
Disclosed is a plastic package for storing a chip, the plastic package being further improved in moisture resistance and reduced in manufacturing costs. The plastic package comprises a plastic package body for storing a chip and a lead electrically connected with the chip, wherein an oxide layer is formed on the surface of a part of the intermediate portion of the lead, the part of the intermediate portion being allowed to adhere to a plastic.

REFERENCES:
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5559364 (1996-09-01), Hojyo et al.
patent: 5742096 (1998-04-01), Lee
patent: 5859471 (1999-01-01), Karaishi et al.
patent: 5898212 (1999-04-01), Kim

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