Plastic molding method for semiconductor devices

Details Plastic molding method for semiconductor devices Plastic molding method for semiconductor devices

1996-02-16

1997-09-02

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Vacuum treatment of work

To degas or prevent gas entrapment

26427217, 2643284, 2643285, 425546, 425116, 425121, B29C 3310, B29C 4502, B29C 4514

Patent

active

056628480

ABSTRACT:
A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.

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