Plastic molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

425121, 425183, 425186, 425192R, 425544, 425588, 425DIG47, 26427217, 249 95, B29C 4502, B29C 4514, B29C 4536

Patent

active

053663640

ABSTRACT:
A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved.

REFERENCES:
patent: 4044984 (1977-08-01), Shimizu et al.
patent: 4372740 (1983-02-01), Kuramochi et al.
patent: 4383672 (1983-05-01), Kreuttner
patent: 4793785 (1988-12-01), Osada
patent: 5082615 (1992-01-01), Sakai
patent: 5108278 (1992-04-01), Tsutsumi et al.
patent: 5116450 (1992-05-01), Spoo et al.
patent: 5252051 (1993-10-01), Miyamoto et al.

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