Plastic-molded-type semiconductor device and producing method th

Details Plastic-molded-type semiconductor device and producing method th Plastic-molded-type semiconductor device and producing method th

1991-11-14

1994-03-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361772, 361773, 174 521, 174 522, 174 524, 174261, 257690, 257784, 257787, H05K 502

Patent

active

052950450

ABSTRACT:
A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

REFERENCES:
patent: 5014113 (1991-05-01), Casto
patent: 5034800 (1991-07-01), Marchisi
patent: 5049527 (1991-09-01), Merrick et al.
patent: 5049977 (1991-09-01), Sako
patent: 5064968 (1991-11-01), Kovacs et al.
patent: 5101324 (1992-03-01), Sato
patent: 5157771 (1992-09-01), Hiroi et al.
patent: 5161304 (1992-11-01), Queyssac et al.
patent: 5166866 (1992-11-01), Kim et al.

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