Plastic molded semiconductor device having waterproof cap

Details Plastic molded semiconductor device having waterproof cap Plastic molded semiconductor device having waterproof cap

1990-09-13

1993-06-29

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257787, 361421, 174 522, H01L 2328, H01L 2504

Patent

active

052237397

ABSTRACT:
A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.

REFERENCES:
patent: 4173712 (1979-11-01), Purser
patent: 4814943 (1989-03-01), Okuaki
patent: 4869755 (1989-09-01), Huschka et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4953002 (1990-08-01), Nelson et al.

Affiliated with

Also associated with

Rating

Plastic molded semiconductor device having waterproof cap does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic molded semiconductor device having waterproof cap, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic molded semiconductor device having waterproof cap will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1757766