Plastic mold type semiconductor device

Details Plastic mold type semiconductor device Plastic mold type semiconductor device

1991-04-29

1993-06-29

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 2348

Patent

active

052237400

ABSTRACT:
A plastic mold semiconductor device comprises a semiconductor chip; a die pad which is made of a thin metallic plate for supporting the semiconductor chip; leads which surround the die pad, wires for connecting electrodes on top of the semiconductor chip and the leads; and plastic mold for sealing the entire device; the die pad being comprised of support sections separated by a fixed gap from a sub-element interconnecting member which is insulated from the semiconductor chip, and connection between the power source or signal related lead and the electrode which is on top the semiconductor chip and is located from the power source or signal related lead is connected by the sub-element interconnecting member.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4937656 (1990-06-01), Kohara
patent: 5089879 (1992-02-01), Komenaka
Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1Mbit DRAM chip by Area Wire Bond Techniques," 1988, pp. 552-557.

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