Plastic lead frames for semiconductor devices, packages includin

Details Plastic lead frames for semiconductor devices, packages includin Plastic lead frames for semiconductor devices, packages includin

1998-11-18

2000-09-26

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438111, 438112, 438123, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

061241512

ABSTRACT:
A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

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