Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-01-11
2005-01-11
Nguyen, Vinh P. (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S111000, C438S112000, C438S123000, C438S126000
Reexamination Certificate
active
06841422
ABSTRACT:
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
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Jiang Tongbi
King Jerrold L.
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