Plastic lead frames for semiconductor devices and packages...

Details Plastic lead frames for semiconductor devices and packages... Plastic lead frames for semiconductor devices and packages...

2006-02-28

2006-02-28

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S677000, C257S735000, C257S780000, C257S783000

Reexamination Certificate

active

07005731

ABSTRACT:
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

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