Plasma treating method and apparatus therefor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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118 501, 118623, 118728, 156345, 156646, 156657, 156662, 20419225, 20419237, 204298, 252 791, 427 38, H01L 21306, B44C 122, B05D 306, C23C 1400

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047955295

ABSTRACT:
This invention relates to a plasma treating method and apparatus therefor. The plasma treating method comprises rendering a gas having a critical potential plasmic under a reduced pressure and changing an acceleration voltage for accelerating ions in the plasma towards a sample interposing the critical potential. The plasma treating apparatus comprises means for rendering a gas having a critical potential plasmic under a reduced pressure and means for changing an acceleration voltage for accelerating ions in the plasma towards a sample interposing the critical potential. According to the present invention, the etching step and the film formation step can be carried out alternately and the plasma treating time can be shortened.

REFERENCES:
patent: 4579623 (1986-04-01), Suzuki et al.
patent: 4622094 (1986-11-01), Otsubo

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