Plasma surface treatment method and apparatus

Details Plasma surface treatment method and apparatus Plasma surface treatment method and apparatus

1987-05-20

1994-04-05

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156668, 156345, 20419212, 20419215, 20419232, 20419236, 20429824, 20429826, 20429835, 118723R, B05D 500, B01J 1500

Patent

active

053001893

ABSTRACT:
A surface treatment method and apparatus permitting the treatment of a film with plasma with a high treatment speed and a high efficiency without uselessly complicating the construction of a device for realizing it are disclosed. The area where the counter electrode is in contact with the plasma is sufficiently larger than the area where the rotating electrode is in contact therewith. The ratio of the areas is preferably not smaller than 1.5 and the etching speed may be increased to a value more than ten times as great as that obtained by a prior art method.

REFERENCES:
patent: 4013539 (1977-03-01), Kuehnle
patent: 4322276 (1982-03-01), Meckel et al.
patent: 4380211 (1983-04-01), Shinohara
patent: 4631105 (1986-12-01), Carroll et al.
Patent Abstracts of Japan, vol. 9; No. 82 (C-275 [1805], 11 Apr. 1985 & JP A-59 213 735 (Kuraray K.K.) Dec. 03, 1984-Abstract.
Patent Abstracts of Japan, vol. 8, No. 199 (C-242) [1636], 12 Sep. 1984; & JP-A-59 91 130 (Matsushita Denki Sangyo K.K.) May 25, 1984.

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