Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2007-09-04
2007-09-04
Tran, Thuy Vinh (Department: 2821)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C156S345380, C156S345480, C156S345510, C156S345540, C118S7230AN, C118S729000
Reexamination Certificate
active
11411163
ABSTRACT:
A plasma reactor includes a toroidal plasma source having an RF power applicator, and RF generator being coupled to the RF power applicator. The reactor further includes a capacitively coupled plasma source power applicator or electrode at the ceiling or the workpiece support, a VHF power generator being coupled to the capacitively coupled source power applicator, a plasma bias power applicator or electrode in the workpiece support and an RF bias power generator coupled to the plasma bias power applicator. A controller adjusts the relative amounts of power simultaneously coupled to plasma in the chamber and conduit by the toroidal plasma source and by the capacitively coupled plasma source power applicator.
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Kim, H.C., et al., “Analytic model for a dual frequency capacitive discharge”, Physics of Plasmas, Nov. 2003, pp. 4545-4551, vol. 10, No. 11, American Institute of Physics, USA.
Hammond, IV Edward P.
Hatcher Brian K.
Holland John P.
Katz Dan
Matyushkin Alexander
Applied Materials Inc.
Tran Thuy Vinh
Wallace Robert M.
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