Plasma reactor apparatus and method for treating a substrate

Details Plasma reactor apparatus and method for treating a substrate Plasma reactor apparatus and method for treating a substrate

1989-03-23

1990-07-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118 501, 118620, 118728, 156345, 2041921, 20419232, 20429808, 427 38, 427 451, B44C 122, B05D 302

Patent

active

049433458

ABSTRACT:
An apparatus and method for treating a substrate with an excited species removed from a plasma (15, 15a, 31, 52, 53) is described. The apparatus includes closed or open end tubes (13, 22, 30, 54 and 55) with apparatus or nozzles (16, 32, 56 and 57) for directing the excited species at a substrate (17, 33, 59) and a tunable plate or sliding short (11, 38, 39, 40) internal or external of the tubes for positioning the plasma in the tube during operation of the apparatus. Tuning or nozzle position or power variations are used. The method and apparatus is useful for depositing films, etching and the like.

REFERENCES:
patent: 4581100 (1986-04-01), Hatzakis et al.
patent: 4664747 (1987-05-01), Sekiguchi et al.
patent: 4718976 (1988-01-01), Fujimura
patent: 4831963 (1989-05-01), Saito et al.

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