Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With multiple gas energizing means associated with one...
Reexamination Certificate
2007-03-06
2007-03-06
Ho, Tan (Department: 2821)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With multiple gas energizing means associated with one...
C315S111210, C118S7230MP, C204S298080
Reexamination Certificate
active
10543857
ABSTRACT:
A plasma processor includes a table on which a target object is to be placed, a vessel which accommodates the table and in which a plasma is to be generated by a high-frequency electromagnetic field, a high-frequency oscillator (30) which generates a high-frequency electromagnetic field, and a reference oscillator (34) which is lower in output power than the high-frequency oscillator (30) and stable in oscillation frequency. A reference signal generated by the reference oscillator (34) is injected into the high-frequency oscillator (30) to fix an oscillation frequency of the high-frequency oscillator (30) at a frequency of a reference signal. Therefore, accurate load matching is performed to improve an energy efficiency when an automatic matching device provided between the high-frequency oscillator (30) and vessel is designed based on the frequency of the reference signal.
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Ishii Nobuo
Shinohara Kibatsu
Al-Nazer Leith A
Blakely & Sokoloff, Taylor & Zafman
Ho Tan
Nihon Koshuha Co., Ltd.
Tokyo Electron Limited
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