Plasma processing method for improving a package of a semiconduc

Details Plasma processing method for improving a package of a semiconduc Plasma processing method for improving a package of a semiconduc

1991-02-25

1992-09-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 26427217, 427 41, H01L 2156

Patent

active

051478226

ABSTRACT:
An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

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Modern Microelectronic Circuit Design, IC Applications, Fabrication Technology, vol. II, Research and Education Assoc., N.Y., N.Y., pp. 674-680.
Wolf et al., "Silicon Processing for the VLSI Era", vol. 1, Processing Technology, Lattice Press, Sunset Beach, Calif. 1986, pp. 171, 172, 191-194.

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