Plasma processing method and apparatus for carrying out the same

Details Plasma processing method and apparatus for carrying out the same Plasma processing method and apparatus for carrying out the same

1984-10-18

1989-02-28

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 20419232, 204298, C23F 0102, H01L 21306

Patent

active

048082589

ABSTRACT:
A plasma processing method and an apparatus for carrying out the method in which a processing gas is introduced into a processing chamber, and periodically an amplitude modulated or frequency-modulated high-frequency voltage is applied to plasma generating means, to generate a discharge plasma and to carry out predetermined processing by the plasma.

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Bruce, R. H., "Anisotropy Control In Dry Etching", Solid State Techn., vol. 24, No. 10, Oct. 1981, pp. 64-68.
Patent Abstracts of Japan, vol. 5, No. 160 (C-75)[832], Oct. 15, 1981; JP-A-56-90978 (Fujitsu) 23-07-1981.

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