Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2006-10-03
2006-10-03
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C118S7230MW, C156S345360, C156S345410, C156S345340
Reexamination Certificate
active
07115184
ABSTRACT:
A plasma processing apparatus includes a processing vessel, a means for holding a substrate to be processed, an evacuation system coupled to the processing vessel, a means for supplying plasma gas to an interior of the processing vessel, a microwave antenna provided on the processing vessel, and a process gas supply part comprised of two components. The first component includes a plurality of first apertures for passing through plasma formed in interior of the processing vessel, a process gas passage, and a plurality of second apertures in communication with the process gas passage. The second component includes a plurality of third apertures axially aligned with the first apertures in the first component and diffusion surfaces upon recessed areas of the second component, located opposite to the second apertures in the first component.
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Office Action issued in corresponding Korean Application (w/english translation).
Office Action issued in corresponding Korean Application (w/English translation).
Supplementary European Search Report dated Oct. 20, 2005 for Application No. EP 02 70 7229.
Goto Tetsuya
Hirayama Masaki
Ohmi Tadahiro
Sugawa Shigetoshi
Dhingra Rakesh
Finnegan Henderson Farabow Garrett & Dunner LLP
Hassanzadeh Parviz
Ohmi Tadahiro
Tokyo Electron Limited
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