Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate
2011-08-23
2011-08-23
Nguyen, Hoai-An D (Department: 2858)
Electricity: measuring and testing
Impedance, admittance or other quantities representative of...
Lumped type parameters
C324S522000
Reexamination Certificate
active
08004293
ABSTRACT:
A method and apparatus for monitoring the integrity of a ground member coupling a substrate support to a chamber body in a plasma processing system is provided. In one embodiment, a processing chamber is provided that includes a ground path member coupled between a substrate support and a chamber body. A sensor is positioned to sense a metric indicative of current passing through the ground member. In another embodiment, a method monitoring the integrity of a ground member coupling a substrate support to a chamber body in a plasma processing chamber includes monitoring a metric indicative of current passing through the ground member during processing, and setting a flag in response to the metric exceeding a predefined threshold.
REFERENCES:
patent: 4771230 (1988-09-01), Zeh
patent: 5423936 (1995-06-01), Tomita et al.
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5900062 (1999-05-01), Loewenhardt et al.
patent: 5900064 (1999-05-01), Kholodenko
patent: 6012600 (2000-01-01), Pham et al.
patent: 6024044 (2000-02-01), Law et al.
patent: 6057235 (2000-05-01), Leiphart et al.
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6221221 (2001-04-01), Al-Shaikh et al.
patent: 6254746 (2001-07-01), Subramanl et al.
patent: 6345589 (2002-02-01), Ramiah et al.
patent: 6349670 (2002-02-01), Nakano et al.
patent: 6364958 (2002-04-01), Lai et al.
patent: 6511577 (2003-01-01), Johnson
patent: 6531030 (2003-03-01), Nakajima
patent: 6652713 (2003-11-01), Brown et al.
patent: 6726805 (2004-04-01), Brown et al.
patent: 6777949 (2004-08-01), Tsuji et al.
patent: 6779481 (2004-08-01), Kent et al.
patent: 6815369 (2004-11-01), Suzuki
patent: 6857387 (2005-02-01), Sun et al.
patent: 7083702 (2006-08-01), Blonigan et al.
patent: 7202690 (2007-04-01), Yamamoto et al.
patent: 2003/0029564 (2003-02-01), Brown et al.
patent: 2003/0047281 (2003-03-01), Hirose et al.
patent: 2003/0079691 (2003-05-01), Shang et al.
patent: 2005/0263070 (2005-12-01), Fink
patent: 2006/0017452 (2006-01-01), Yamamoto et al.
patent: 2006/0060302 (2006-03-01), White et al.
patent: 2006/0066247 (2006-03-01), Koshiishi et al.
patent: 2006/0171848 (2006-08-01), Roche et al.
patent: 2007/0035908 (2007-02-01), Kitsunai et al.
patent: 1030345 (2000-08-01), None
patent: 10-0264445 (2000-11-01), None
Office Action dated Jan. 28, 2009 for Korean Patent Application No. 10-2007-0106554.
Office Office dated Jul. 24, 2009 for Chinese Patent Application No. 2007101653378.
Sorensen Carl
White John M.
Applied Materials Inc.
Nguyen Hoai-An D
Patterson & Sheridan L.L.P.
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