Plasma processing apparatus, semiconductor manufacturing...

Details Plasma processing apparatus, semiconductor manufacturing... Plasma processing apparatus, semiconductor manufacturing...

2005-02-25

2008-07-01

Hassanzadeh, Parviz (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C118S728000, C118S729000, C118S730000, C156S345520, C156S345530, C156S345540, C156S345550, C361S234000, C279S128000

Reexamination Certificate

active

07393433

ABSTRACT:
A wiring member which becomes substantially symmetrical on the plane of an electrostatic chuck unit is connected to the tip end of an RF introduction rod between the RF introduction rod and the electrostatic chuck unit in order to make uniform generation of an electric field due to bias RF which becomes a cause of plasma damage. The connection point between the electrostatic chuck unit and the wiring member may be single or plural.

REFERENCES:
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patent: 6267839 (2001-07-01), Shamouilian et al.
patent: 6494958 (2002-12-01), Shamouilian et al.
patent: 6616767 (2003-09-01), Zhao et al.
patent: 6620290 (2003-09-01), Yamamoto et al.
patent: 2003/0079983 (2003-05-01), Long et al.
patent: 2004/0245935 (2004-12-01), Takayama et al.
patent: 10-242244 (1998-09-01), None
patent: 2003-160138 (2003-06-01), None

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