Coating apparatus – Gas or vapor deposition – With treating means
Patent
1997-10-24
2000-03-28
Lacey, David
Coating apparatus
Gas or vapor deposition
With treating means
156345, 20429802, 20429806, 20429831, 20429834, C23C 1600, C23C 1400, C23F 102
Patent
active
060417331
ABSTRACT:
A plasma processing apparatus such as a plasma etching apparatus, which is not subject to arcing to the gas distributor plate which is caused by secondary potentials generated by polymers adhering to a gas distribution plate. The gas distribution plate is electrically isolated from the ground electric potential, and does not have any polarity. The gas distribution plate may be formed of an insulating material. Furthermore, a support plate may be adapted to fix the gas distribution plate to a chamber of the apparatus in such a manner that the gas distribution plate is detachably coupled with the support plate. Thereby, it is easier to separate the gas distribution plate from the apparatus to remove the accumulated polymers during the plasma process.
REFERENCES:
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5567243 (1996-10-01), Foster et al.
patent: 5643394 (1997-07-01), Maydan et al.
patent: 5882414 (1999-03-01), Fong et al.
patent: 5885402 (1999-03-01), Esquibel
Choi Byung-mook
Kim Chang-Sik
Kim Ju-ho
Lim Tae-hyung
Moon Kyeong-seob
Becker Drew
Lacey David
Samsung Electronics Co,. Ltd.
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