Plasma processing apparatus protected from discharges in associa

Coating apparatus – Gas or vapor deposition – With treating means

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Details

156345, 20429802, 20429806, 20429831, 20429834, C23C 1600, C23C 1400, C23F 102

Patent

active

060417331

ABSTRACT:
A plasma processing apparatus such as a plasma etching apparatus, which is not subject to arcing to the gas distributor plate which is caused by secondary potentials generated by polymers adhering to a gas distribution plate. The gas distribution plate is electrically isolated from the ground electric potential, and does not have any polarity. The gas distribution plate may be formed of an insulating material. Furthermore, a support plate may be adapted to fix the gas distribution plate to a chamber of the apparatus in such a manner that the gas distribution plate is detachably coupled with the support plate. Thereby, it is easier to separate the gas distribution plate from the apparatus to remove the accumulated polymers during the plasma process.

REFERENCES:
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5567243 (1996-10-01), Foster et al.
patent: 5643394 (1997-07-01), Maydan et al.
patent: 5882414 (1999-03-01), Fong et al.
patent: 5885402 (1999-03-01), Esquibel

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