Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With radio frequency antenna or inductive coil gas...
Reexamination Certificate
2005-05-03
2005-05-03
Lund, Jeffrie R. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With radio frequency antenna or inductive coil gas...
C156S345330, C118S715000, C118S7230AN
Reexamination Certificate
active
06887341
ABSTRACT:
A plasma processing apparatus for spatial control of dissociation and ionization and a method for controlling the dissociation and ionization in the plasma. An aspect of the present invention provides a plasma processing apparatus for spatial control of dissociation and ionization includes a process chamber, a plasma generating system configured and arranged to produce a plasma in the process chamber, a substrate holder configured to hold a substrate during substrate processing, a gas source configured to introduce gases into the process chamber, a pressure-control system for maintaining a selected pressure within the process chamber, and, a plurality of partitions dividing the internal volume of the process chamber into one or more spatial zones. These partitions extend from a wall of the process chamber toward said substrate holder.
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Fink Steven T.
Moroz Paul
Strang Eric J.
Lund Jeffrie R.
Pillsbury & Winthrop LLP
Tokyo Electron Limited
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