Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2006-01-10
2009-06-02
Hassanzadeh, Parviz (Department: 1792)
Coating apparatus
Gas or vapor deposition
With treating means
Reexamination Certificate
active
07540257
ABSTRACT:
A plasma processing apparatus of this invention includes a sealable chamber to be introduced with reactive material gas, a plurality of pairs of cathode-anode bodies arranged in the chamber, for forming a plurality of discharge spaces for performing plasma discharge of the material gas, a power supply for plasma discharge, placed outside the chamber, a matching box placed outside the chamber, for matching impedance between the cathode-anode bodies and the power supply, and a power introduction wire extending to each of the cathodes from the power supply via the matching box. Herein, the power introduction wire is branched to the number corresponding to the number of the cathodes between the matching box and the cathodes, and the branched wires are symmetrically extended.
REFERENCES:
patent: 4264393 (1981-04-01), Gorin et al.
patent: 4287851 (1981-09-01), Dozier
patent: 4292153 (1981-09-01), Kudo et al.
patent: 4381965 (1983-05-01), Maher et al.
patent: 4633811 (1987-01-01), Maruyama
patent: 4664890 (1987-05-01), Tawada et al.
patent: 4676865 (1987-06-01), DeLarge
patent: 4825806 (1989-05-01), Tawada et al.
patent: 4887005 (1989-12-01), Rough et al.
patent: 5041201 (1991-08-01), Yamazaki et al.
patent: 5061359 (1991-10-01), Babu et al.
patent: 5082547 (1992-01-01), DeLarge
patent: 5515986 (1996-05-01), Turlot et al.
patent: 5653810 (1997-08-01), Kataoka et al.
patent: 5753886 (1998-05-01), Iwamura et al.
patent: 5795452 (1998-08-01), Konoshita et al.
patent: 5834730 (1998-11-01), Suzuki et al.
patent: 5958141 (1999-09-01), Kitabatake et al.
patent: 6017396 (2000-01-01), Okamoto
patent: 6189485 (2001-02-01), Matsuda et al.
patent: 6349670 (2002-02-01), Nakano et al.
patent: 2003/0155332 (2003-08-01), Datta et al.
patent: 2003/0164143 (2003-09-01), Toyoda et al.
patent: 2004/0187785 (2004-09-01), Kishimoto et al.
patent: 2006/0087211 (2006-04-01), Kishimoto et al.
patent: 2006/0191480 (2006-08-01), Kishimoto et al.
patent: 0 689 226 (1995-12-01), None
patent: 54-106081 (1979-08-01), None
patent: 60-624 (1985-01-01), None
patent: 61-214513 (1986-09-01), None
patent: 4-164895 (1992-06-01), None
patent: 9-209151 (1997-08-01), None
patent: 2000-294511 (2000-10-01), None
patent: 2001-85409 (2001-03-01), None
patent: 2004-22638 (2004-01-01), None
patent: 2004-259853 (2004-09-01), None
patent: 2005/045873 (2005-05-01), None
European Search Report mailed Jun. 1, 2006 in corresponding EP Application No. 06000502.2
U.S. Final Office Action mailed Aug. 4, 2008 in corresponding U.S. Appl. No. 11/252,885.
European Search Report mailed May 12, 2006 in EP application No. 06000503.0.
Patent Abstracts of Japan, vol. 009, No. 143 (E-322) Jun. 18, 1985 & JP 60 025235 A (Hitachi Seisakusho KK), Feb. 8, 1985.
U.S. Office Action mailed Oct. 5, 2007 in U.S. Appl. No. 10/787,748.
U.S. Office Action mailed Dec. 14, 2007 in U.S. Appl. No. 11/252,885.
Fukuoka Yusuke
Kishimoto Katsushi
Crowell Michelle
Hassanzadeh Parviz
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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