Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2006-12-12
2006-12-12
Kackar, Ram N. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345240, C156S345250, C118S712000, C204S192330, C204S298030, C204S298320, C216S067000
Reexamination Certificate
active
07147747
ABSTRACT:
A plasma processing apparatus having a process chamber in which an object to be processed is subjected to plasma processing includes a light-receiving part for a spectrometer unit, an arithmetic unit, a database, a determination unit and an apparatus controller. The determination unit determines a condition in the processing chamber that an end point of seasoning is reached. The determination of the condition is performed so that one or more differences between one or more output signals derived from a batch of plasma emission data by multivariate analysis and one or more output signals derived from a preceding batch of plasma emission data are found, an average value of the differences in one batch, a difference between a maximum and a minimum of the differences in one batch and a standard deviation of the differences in one batch are determined, and the values are compared with a preset threshold.
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Kitsunai Hiroyuki
Masuda Toshio
Miya Go
Tanaka Junichi
Yamamoto Hideyuki
Antonelli, Terry Stout and Kraus, LLP.
Hitachi High-Technologies Corporation
Kackar Ram N.
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