Plasma processing apparatus and method, and electrode plate...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S7230ER

Reexamination Certificate

active

07494561

ABSTRACT:
A plasma processing apparatus includes a process container configured to have a vacuum atmosphere therein. A first upper electrode is disposed to have a ring shape and to face a target substrate placed within the process container. A second upper electrode is disposed radially inside the first upper electrode and electrically insulated therefrom. A first electric feeder is configured to supply a first RF output from a first RF power supply to the first upper electrode at a first power value. A second electric feeder branches from the first electric feeder and is configured to supply the first RF output from the first RF power supply to the second upper electrode at a second power value smaller than the first power value.

REFERENCES:
patent: 5707486 (1998-01-01), Collins
patent: 6072147 (2000-06-01), Koshiishi et al.
patent: 6894245 (2005-05-01), Hoffman et al.
patent: 2001/0037770 (2001-11-01), Otsubo
patent: 10-134995 (1998-05-01), None
patent: 11-260596 (1999-09-01), None
patent: 2000-323460 (2000-11-01), None
patent: 2001-15495 (2001-01-01), None
patent: 2001-17852 (2001-01-01), None
patent: 2001313286 (2001-11-01), None
patent: WO 02/067313 (2002-08-01), None
English Machine Translation of Japanese Kokai 2000-323460 to Hirose. Obtained from http://www19.ipdl.inpit.go.jp/PA1/cgi-bin/PA1INDEX on Dec. 10, 2007.
English Machine Translation of Japanese Kokai 2001-313286 to Segawa. Obtained from http:///www19.ipdl.inpit.go.jp/PA1/cgi-bin/PA1INDEX on Dec. 10, 2007.
English Machine Translation of Japnaese Kokai 2001-017852 to Ozawa. Obtained from http://www19.ipdl.inpit.go.jp/PA1/cgi-bin/PA1INDEX on Dec. 10, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma processing apparatus and method, and electrode plate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus and method, and electrode plate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus and method, and electrode plate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4090205

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.