Plasma processing apparatus and evacuation ring

Details Plasma processing apparatus and evacuation ring Plasma processing apparatus and evacuation ring

2007-08-14

2007-08-14

Lund, Jeffrie R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With etchant gas supply or exhaust structure located outside...

C156S345430, C156S345470, C118S715000, C118S7230ER

Reexamination Certificate

active

11047595

ABSTRACT:
A plasma processing apparatus having an evacuation ring with high plasma resistance and capable of minimizing abnormal discharge is provided. A processing chamber100includes a ceiling unit110at which an upper electrode112is provided and a container unit120having a lower electrode122provided to face opposite the upper electrode112, on which a substrate can be placed. An evacuation ring126is provided around the lower electrode122so as to divide the space in the processing chamber100into a plasma processing space102and an evacuation space104. At the evacuation ring126, through holes126aand blind holes126bwhich are fewer than the through holes126aand open toward the plasma processing space102are formed. An insulation coating constituted of Y2O3is applied onto the surface of the evacuation ring126towards the plasma processing space102.

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