Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2011-04-26
2011-04-26
Hassanzadeh, Parviz (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345280, C156S345510, C156S345520, C156S345530, C156S345540, C156S345550, C118S7230ER, C118S7230ER, C361S234000
Reexamination Certificate
active
07931776
ABSTRACT:
A plasma processing apparatus including a chamber having an inner wall with a protective film thereon and a sample stage disposed in the chamber in which plasma is generated by supplying high-frequency wave energy to processing gas to conduct plasma processing for a sample on the sample stage using the plasma. The apparatus includes a control device which determines, based on monitor values of a wafer attracting current monitor (Ip) to monitor a current supplied from a wafer attracting power source, an impedance monitor (Zp) to monitor plasma impedance viewed from a plasma generating power source, and an impedance monitor (Zb) to monitor a plasma impedance viewed from a bias power supply, presence or absence of occurrence of an associated one of abnormal discharge in inner parts, deterioration in insulation of an insulating film of a wafer attracting electrode, and abnormal injection in a gas injection plate.
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Japanese Office Action issued in Japanese Patent Application No. 2006-071027, dated Oct. 15, 2010.
Itabashi Naoshi
Kanno Seiichiro
Tetsuka Tsutomu
Yoshigai Motohiko
Dhingra Rakesh
Hassanzadeh Parviz
Hitachi High-Technologies Corporation
McDermott Will & Emery LLP
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