Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1993-02-17
1994-05-31
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419212, 20429808, 20429834, C23C 1434
Patent
active
053166450
ABSTRACT:
A plasma processing apparatus comprises: a first electrode connectable with a plasma generating power source; a second electrode capable of supporting a substrate to be subjected to a plasma-involving surface treatment; a third electrode enclosing a space between the first and second electrodes, all the electrodes being positioned in an evacuatable chamber; and potential control means for controlling the potential of the third electrode.
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Goto Haruhiro H.
Ohmi Tadahiro
Okamura Nobuyuki
Shibata Tadashi
Yamagami Atsushi
Applied Materials Japan Inc.
Canon Kabushiki Kaisha
Nguyen Nam
Ohmi Tadahiro
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