Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

1993-01-22

1998-01-20

Werner, Frank E.

Material or article handling

Device for emptying portable receptacle

Nongravity type

104 36, 4147445, 414937, 414940, B65G 6500

Patent

active

057095191

ABSTRACT:
A plasma processing apparatus for etching, ashing, or otherwise processing silicon wafers has a pair of spaced reaction chambers each for processing a silicon wafers in a plasma, a pair of spaced cassette table mechanisms each for supporting a wafer cassette which houses a plurality of wafers therein, and a transfer robot disposed between the pair of spaced reaction chambers and the pair of spaced cassette table mechanisms, for transferring the wafers, one at a time, between the wafer cassette supported by one of the workpiece table mechanisms and one of the reaction chambers. Each of the cassette table mechanisms has a turntable for placing the wafer thereon, the turntable being rotatable to orient the wafer cassette out of physical interference with the robot arm of the transfer robot.

REFERENCES:
patent: 1253864 (1918-01-01), Miura
patent: 1379239 (1921-05-01), Barwicki
patent: 4550239 (1985-10-01), Uehara et al.
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4781511 (1988-11-01), Harada et al.
patent: 4923054 (1990-05-01), Ohtani et al.
patent: 5048164 (1991-09-01), Harima
patent: 5162047 (1992-11-01), Wade et al.

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