Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2008-09-29
2011-12-13
Hassanzadeh, Parviz (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S345420, C118S7230MW, C118S7230MR
Reexamination Certificate
active
08075733
ABSTRACT:
A plasma processing apparatus includes: a decompression chamber of which the inside is depressed; a gas supply unit that supplies process gas into said chamber; a microwave supply unit that supplies a microwave into the chamber to generate plasma; an object-placing electrode where a processing material, is placed and which holds the processing material in the chamber; and a vacuuming unit that is connected to the chamber to discharge the gas in the chamber, in which the chamber, a part for providing gas into the chamber of the gas supply unit, a part for introducing a microwave into the chamber of the microwave supply unit, the object-placing electrode, and the vacuuming unit are disposed coaxially with the center axis of the chamber, and the part for introducing a microwave includes a microwave rotation generator that rotates a polarization plane of the input microwave and supplies the microwave to the chamber.
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Masamitsu Nakajima, Microwave Engineering (in Japanese), 91975), p. 67, Morimoto Publishing, Co., Ltd.
Nishimori Yasuhiro
Tauchi Susumu
Watanabe Seiichi
Yasui Naoki
Antonelli, Terry Stout & Kraus, LLP.
Dhingra Rakesh
Hassanzadeh Parviz
Hitachi High-Technologies Corporation
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