Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

2007-04-05

2010-02-16

Fitzgerald, John (Department: 2856)

Coating apparatus

Gas or vapor deposition

C141S285000

Reexamination Certificate

active

07662232

ABSTRACT:
The object of the invention is to provide a plasma processing apparatus having enhanced plasma processing uniformity. The plasma processing apparatus comprises a processing chamber1, means13and14for supplying processing gas into the processing chamber, evacuation means25and26for decompressing the processing chamber1, an electrode4on which an object2to be processed such as a wafer is placed, and an electromagnetic radiation power supply5A, wherein at least two kinds of processing gases having different composition ratios of O2or N2are introduced into the processing chamber through different gas inlets so as to control the in-plane uniformity of the critical dimension while maintaining the in-plane uniformity of the process depth.

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patent: 2002-184764 (2002-06-01), None
patent: 2003-206042 (2003-07-01), None

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