Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

2007-01-30

2007-01-30

Alejandro-Mulero, Luz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C118S7230ER

Reexamination Certificate

active

10358894

ABSTRACT:
A plasma processing apparatus for providing plasma processing to an object placed inside a processing chamber includes a vacuum chamber, a process gas feeder feeding gas into the vacuum chamber, a wafer electrode disposed within the vacuum chamber for mounting the object, a wafer bias power generator supplying bias voltage to the wafer electrode, and a plasma generator for generating plasma within the vacuum chamber. The wafer bias power generator includes a clip circuit for clipping either a positive-side voltage or a negative-side voltage to a predetermined voltage.

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patent: 6432834 (2002-08-01), Kim
patent: 6660647 (2003-12-01), Ono et al.
patent: 6806201 (2004-10-01), Sumiya et al.
patent: 2003/0094239 (2003-05-01), Quon et al.

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