Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

2006-09-12

2006-09-12

McDonald, Rodney G. (Department: 1753)

Coating apparatus

Gas or vapor deposition

With treating means

C118S7230ER, C156S345340, C156S345430, C156S345470, C204S298070, C204S298330, C204S298340

Reexamination Certificate

active

07104217

ABSTRACT:
The present invention provides a plasma processing apparatus having an electrode plate arranging therein, an upper electrode to which a dielectric member or a cavity portion is provided, a dimension or a dielectric constant of which is determined in such a manner that resonance is generated at a frequency of high-frequency power supplied to the center of the back side and an electric field orthogonal to the electrode plate is generated, and a susceptor as a lower electrode so as to be opposed to each other, in order to reduce unevenness of an electric field distribution on the surface of the electrode in a plasma processing using a high-density plasma capable of coping with further refinement.

REFERENCES:
patent: 4148705 (1979-04-01), Battey et al.
patent: 5074456 (1991-12-01), Degner et al.
patent: 6110287 (2000-08-01), Arai et al.
patent: 6228438 (2001-05-01), Schmitt
patent: 2003/0155078 (2003-08-01), Ogasawara et al.
patent: 1193746 (2002-04-01), None
patent: 05-29137 (1993-04-01), None
patent: 2000-77384 (2000-03-01), None
patent: WO 00/68985 (2000-11-01), None
International Search Report, PCT/JP01/03245, Jul. 24, 2001.

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