Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

2005-09-27

2005-09-27

Hassenzadeh, Parviz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345430, C156S345470, C156S345510

Reexamination Certificate

active

06949165

ABSTRACT:
An electrical connection means45guides a DC voltage, which is generated in an ion sheath when a plasma is excited, to a first electrode31where a substrate W is placed. Hence, the DC voltage is applied to both the upper and lower surfaces of the substrate W, so the two surfaces of the substrate have the same potential. As a result, element breakdown, which occurs when a large potential difference occurs between the two surfaces of the substrate W, can be prevented.

REFERENCES:
patent: 5534751 (1996-07-01), Lenz et al.
patent: 5868848 (1999-02-01), Tsukamoto
patent: 5928528 (1999-07-01), Kubota et al.
patent: 6041734 (2000-03-01), Raoux et al.
patent: 6112697 (2000-09-01), Sharan et al.
patent: 2001/0013504 (2001-08-01), Imafuku et al.
patent: 09283498 (1997-10-01), None

Affiliated with

Also associated with

Rating

Plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3374085