Plasma etching of blind vias in printed wiring board dielectric

Details Plasma etching of blind vias in printed wiring board dielectric Plasma etching of blind vias in printed wiring board dielectric

1987-04-13

1988-01-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156644, 156646, 156652, 156656, 1566591, 156668, 156902, 156345, 20419236, 252 791, 427 97, B44C 122, C03C 1500, C23F 102, B29C 3700

Patent

active

047203226

ABSTRACT:
A method of plasma etching blind vias in printed wiring board dielectric which comprises the steps of providing a printed wiring board of organic material having a buried electrically conductive pattern in the organic material and an electrically conductive layer on the surface of the board, removing predetermined portions of the electrically conductive layer to expose the organic material thereunder and define at least one via location thereat, providing a plasma etching chamber having one or more pairs of spaced parallel electrodes, positioning the board between the said electrodes, electrically connecting the board to one of said electrodes and having the surface facing and parellel to the electrodes, filling the chamber with a mixture of an oxidizing gas and a fluorocarbon gas, etching the organic material from the exposed organic material at the surface to the buried pattern to expose the buried pattern by applying an RF signal across the electrodes, and forming an electrically conductive layer of the exposed surfaces of the organic material contacting the exposed buried pattern and the conductive layer.

REFERENCES:
patent: 4496420 (1985-01-01), Frohlich et al.
patent: 4517050 (1985-05-01), Johnson et al.
patent: 4567062 (1984-10-01), Fan
patent: 4572764 (1984-12-01), Fan
patent: 4642160 (1987-02-01), Burgess
patent: 4676865 (1987-06-01), DeLarge

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