Plasma etching of aluminum

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 1566591, 156665, 204192E, 252 791, C23F 102

Patent

active

043753850

ABSTRACT:
A method of improving uniformity of etching in the plasma etching of a substrate of aluminum and its alloys by supporting the substrate on a getter plate of a metal such as tantalum. The getter plate extends beyond the substrate for a distance sufficient to improve the uniformity of etching across the substrate.

REFERENCES:
patent: 4073669 (1978-02-01), Heinecke et al.
patent: 4148705 (1979-04-01), Battey et al.
patent: 4243506 (1981-01-01), Ikeda et al.
patent: 4333793 (1982-06-01), Lifshitz et al.
patent: 4337132 (1982-06-01), Jones

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