Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With radio frequency antenna or inductive coil gas...
Reexamination Certificate
2005-08-09
2005-08-09
Hassanzadeh, P. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With radio frequency antenna or inductive coil gas...
Reexamination Certificate
active
06926800
ABSTRACT:
A plasma etching apparatus for etching semiconductor wafers. The plasma etching apparatus has a reaction tube made of a dielectric material and a high frequency antenna located around the reaction tube for generating a plasma inside the reaction tube. The high frequency antenna has a sloped segment that produces a relatively large capacitive coupling with the reaction tube. The high frequency antenna is moved by a driver around the reaction tube in a horizontal plane.
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Ibi Koji
Komuro Genichi
Okita Yoichi
Suzuki Minoru
Tachino Yuuichi
Crowell Michelle
Fujitsu Limited
Hassanzadeh P.
Staas & Halsey , LLP
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