Plasma etch process for multilayer vias having an organic...

Details Plasma etch process for multilayer vias having an organic... Plasma etch process for multilayer vias having an organic...

2006-10-24

2006-10-24

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21218, C257SE21577, C257SE21313, C257SE21600, C257SE21024

Reexamination Certificate

active

07125796

ABSTRACT:
A process is provided for fabricating a via52between bonded wafers without undercutting an organic bonding material32. The process for forming the via52in a structure including a dielectric material14and an organic bonding material32, comprises forming a resist material42on the dielectric layer14and etching through the dielectric layer14and the organic bonding material32with 60CF4/20Ar/60CHF3/20N2. The resist may then be removed with an anisotropic high density oxygen plasma.

REFERENCES:
patent: 5719089 (1998-02-01), Cherng et al.
patent: 6174800 (2001-01-01), Jang
patent: 6261947 (2001-07-01), McTeer
patent: 6291887 (2001-09-01), Wang et al.
patent: 6348407 (2002-02-01), Gupta et al.
patent: 6372631 (2002-04-01), Wang et al.
patent: 6759263 (2004-07-01), Ying et al.
patent: 2005/0255697 (2005-11-01), Nguyen et al.
Kuchenmeister et al., “A Comparative CMP Study of BCB and SiLK for Copper Damascene Technologies,” Advanced Metallization Conference Proceedings 1998, pp. 237.242.
Schier, Michael, “Reactive Ion Etching of Benzocyclobutene Using a Silicon Nitride Dielectric Etch Mask,” J. Electrochemical Society, vol. 142, No. 9, Sep. 1995, pp. 3238-3240.

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