Plasma etch apparatus with conductive coating on inner metal sur

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156643, 20429831, H01L 21306, B44C 122

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active

050857274

ABSTRACT:
An improved plasma etching apparatus is disclosed comprising an etch chamber having inner metal surfaces with a conductive coating formed thereon which is capable of protecting such inner metal surfaces from chemical attack by reactant gases such as halogen-containing gases used in said chamber during plasma etching processes. In a preferred embodiment, at least about 0.2 micrometers of a carbon coating is formed on the inner metal surfaces of the etch chamber by a plasma-assisted CVD process using a gaseous source of carbon and either hydrogen or nitrogen or both.

REFERENCES:
patent: 4427516 (1984-01-01), Levinstein et al.
patent: 4526644 (1985-07-01), Fujiyama et al.
patent: 4693777 (1987-09-01), Hazano et al.

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