Plasma enhanced OMCVD of thin film coating for polymeric fibers

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

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427575, 427576, H05H 120, H05H 130

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058768084

ABSTRACT:
A plasma enhanced chemical vapor deposition process for depositing a titanium nitride film on a polymeric substrate is provided, the process including placing the polymeric substrate within a chemical vapor deposition chamber evacuated to a pressure within a range of from about 0.1 Torr to about 10 Torr, heating the polymeric substrate to a temperature within a range of from about 150.degree. C. to about 250.degree. C., introducing a vaporized organometallic compound and ammonia gas into the chamber, generating a plasma within the chamber, and, maintaining the polymeric substrate within the chamber for a time sufficient for a layer of titanium nitride to deposit upon the polymeric substrate.

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Fix et al, "Synthesis of Thin Films by Atmospheric Pressure Chemical Vapor Deposition Using Amido and Zmido Titanium(IV) Compounds as Precursors", Chem. Mater., 1990, 2, pp. 235-241, 1990 No month.

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