Plasma enhanced atomic layer deposition system having...

Details Plasma enhanced atomic layer deposition system having... Plasma enhanced atomic layer deposition system having...

2005-03-25

2008-09-09

Zervigon, Rudy (Department: 1792)

Coating apparatus

Gas or vapor deposition

Multizone chamber

C118S666000, C118S663000, C118S729000

Reexamination Certificate

active

07422636

ABSTRACT:
A plasma enhanced atomic layer deposition (PEALD) system is described, wherein the system comprises a processing space and a high vacuum, ultra-clean transfer space. During processing, the substrate to which the thin conformal film is formed is exposed to the processing space. During substrate transfer, the substrate is exposed to the high vacuum space. Processing gases are introduced sequentially and alternately to the process chamber and the pressures and gas flows within, to and from, and between the process chamber and the high vacuum transfer space are controlled to keep the transfer space ultra-clean.

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EPO, International Search Report and Written Opinion of the International Searching Authority, International Application No. PCT/US2006/009984, Mailed on Aug. 3, 2006 (15 pages).

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