Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article
Reexamination Certificate
2003-03-11
2004-11-09
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making named article
C445S024000, C430S198000
Reexamination Certificate
active
06815149
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a method of manufacturing surface-discharge-scheme alternating-current-type plasma display panels, and more particularly, to a method of forming components, such as a dielectric layer and the like, of the plasma display panel.
The present application claims priority from Japanese Application No. 2002-68149, the disclosures of which are incorporated herein by reference for all purposes.
2. Description of the Related Art
At the present time, surface-discharge-type AC plasma display panels (hereinafter referred to as “PDP”) have received attention as large-sized flat color-screen displays, and have increasingly become commonly used in ordinary homes.
FIGS. 6 and 7
illustrate the configuration of a surface-discharge-type alternating-current PDP which has been proposed by the present applicant.
FIG. 6
is a schematically perspective view of the proposed PDP when the front glass substrate is disassembled from the back glass substrate.
FIG. 7
is a sectional view taken along the column direction of the PDP at a central point in discharge cells.
The PDP in
FIGS. 6 and 7
includes a front glass substrate
1
having a back surface on which a plurality of row electrode pairs (X, Y) are arranged at regular intervals in the column direction and each extends in the row direction. Each of the row electrodes X and Y forming the row electrode pair (X, Y) is constructed of T-shaped transparent electrodes Xa (Ya) and a bus electrode Xb (Yb) extending in the row direction. The transparent electrodes Xa and Ya are opposite to each other with a discharge gap g set at a required distance and interposed in between.
A dielectric layer
2
is also formed on the back surface of the front glass substrate
1
so as to cover the row electrode pairs (X, Y). In turn, additional dielectric layers
3
are formed on the back surface of the dielectric layer
2
, and covered with a protective layer (not shown) made of MgO.
Further, a black additional layer
3
A formed of a black light-absorbing material is formed on a portion of the additional dielectric layer
3
and opposite a zone between the bus electrodes Xb (Yb) of the back-to-back row electrodes X (Y).
On a surface of a back glass substrate
4
on the display screen side, a plurality of column electrodes D and a column electrode protective layer
5
covering the column electrodes D are formed, and then a partition wall
6
is formed on the column electrode protective layer
5
.
The partition wall
6
is constructed of pairs of first transverse walls
6
A, pairs of second transverse walls
6
B and transverse walls
6
C. The pairs of first transverse walls
6
A and the pairs of second transverse walls
6
B are arranged in alternate positions in the column direction. The first or second transverse walls
6
A or
6
B in each pair are positioned back to back in between adjacent display lines.
A clearance r is formed between the second transverse wall
6
B and the protective layer covering the additional dielectric layer
3
.
The opposing first transverse walls
6
A, the opposing second transverse walls
6
B and the vertical walls
6
C of the partition wall
6
partition the discharge space defined between the front glass substrate
1
and the back glass substrate
4
into display discharge cells C
1
. Red-, green-, and blue-colored phosphor layers
7
are each formed in the display discharge cell C
1
and are arranged in order in the row direction.
Further, a protrusion rib
8
protrudes into a space formed between the two back-to-back second transverse walls
6
B and raises a part of the column electrode D, located between the two second transverse walls
6
B, and the column electrode protective layer
5
covering this column electrode D, to cause them to be in contact with the black additional layer
3
A.
Thus, two addressing discharge cells C
2
are formed on both sides of the protrusion rib
8
, and each communicates with the corresponding display discharge cells C
1
through the clearances r.
When additional layers of a dielectric layer are formed in multilayer formation as in the case of the above PDP, a lamination of the additional layers (for example, the additional dielectric layer
3
and the black additional layer
3
A) on the dielectric layer is carried out by prior art methods typically including the following steps.
A prior art method using a photosensitive dielectric film for forming the lamination of the additional layers of the dielectric layer is here described.
Initially, as illustrated in
FIG. 8A
, a photosensitive dielectric film F
1
is laminated on the dielectric layer
2
of the glass substrate
1
on which the row electrodes (not shown) and the dielectric layer
2
are formed. Then, as illustrated in
FIG. 8B
, a mask M
1
having through-holes M
1
a
formed therein in correspondence with positions and shape of additional dielectric layers
3
to be formed is laid on the photosensitive dielectric film F
1
. The photosensitive dielectric film F
1
is exposed to light through the mask M
1
to undergo patterning.
Then, as illustrated in
FIG. 8C
, the photosensitive dielectric film F
1
is developed to remove the unexposed regions, and then the remaining exposed regions are burned to form additional dielectric layers
3
.
Then, as illustrated in
FIG. 8D
, a photosensitive dielectric film F
2
is laminated on the dielectric layer
2
and the additional dielectric layers
3
which is formed as described.
Then, similarly, as illustrated in
FIG. 8E
, a mask M
2
having through-holes M
2
a
formed therein in correspondence with positions and shape of additional dielectric layers
3
A to be formed is laid on the photosensitive dielectric film F
2
. The photosensitive dielectric film F
2
is exposed to light through the mask M
2
to undergo patterning.
After this patterning process, as illustrated in
FIG. 8F
, the photosensitive dielectric film F
2
is developed to remove the unexposed regions, and then the remaining exposed regions are burned to form additional dielectric layers
3
A.
However, in the case of the above prior art method using a photosensitive dielectric layer for forming the additional layers of the dielectric layer in multilayer form, when the photosensitive dielectric film F
2
is laminated in order to form the additional dielectric layers
3
A which is the second layer, protrusions and hollows presented by the pre-formed additional dielectric layers
3
cause crinkles in the photosensitive dielectric film F
2
, and therefore adhesion between the photosensitive dielectric film F
2
and the dielectric layer
2
is insufficient, giving rise to a problem of peeling in the developing or burning process.
Further, with this prior art method, the initially formed additional dielectric layers
3
are shrunk in shape in the burning process. This shrinkage results in the strict necessity for high precision in alignment in the patterning process for the second layer for the additional dielectric layers
3
A. The uneven top surfaces of the additional dielectric layers
3
after undergoing the burning process gives rise to a problem of the sliding of the photosensitive dielectric film F
2
during the developing process for forming the second layer for the additional dielectric layers
3
A.
The prior art method has further problems of an increase in manufacturing costs and a decrease in efficiency of working because of the increase in manufacturing steps due to repeating the exposure, development and burning processes for forming the first layer and the second layer which are to be the additional layers of the dielectric layer.
The prior art method has yet another problem of a relatively positional deviation produced between the pattern of the row electrode and the additional layers of the dielectric layer because the repeating of the burning processes creates deformation or shrinkage of the glass substrate
1
.
Another prior art method using pattern printing for multilayer formation of additional layers of the dielectric layer is now described. First, as i
Higashi Hirofumi
Ogane Shingo
Arent Fox PLLC.
McPherson John A.
Pioneer Corporation
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