Plasma desmear/etchback system and method of use

Details Plasma desmear/etchback system and method of use Plasma desmear/etchback system and method of use

1986-02-07

1987-06-30

Kellogg, Arthur

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156644, 156656, B44C 122

Patent

active

046768653

ABSTRACT:
A process for etching back the exposed edges of layers of resin in drilled, multi-layered resin/copper laminates. The process includes the steps of heating at least one of the electrode plates in an evacuated chamber and causing a flow of plasma to pass between adjacent plates resulting in the removal of resin from the exposed surface of the copper layers. The invention also includes the apparatus used to carry out this process.

REFERENCES:
patent: 4012307 (1977-03-01), Phillips
patent: 4430547 (1984-02-01), Yoneda et al.

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