Plasma descaling of metals

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...

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216 75, 216 76, 216 77, 148421, H05H 100

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060106352

ABSTRACT:
The plasma descaling process of the present invention removes surface oxides selectively from structural metal surfaces, especially titanium and its alloys, and, with appropriate control of the reaction temperature, is self-limiting to avoid cracking problems otherwise associated with intergranular attack. In a preferred embodiment of the present invention, a fluoride plasma reacts with surface oxides on a titanium alloy to remove scale and alpha case in a temperature controlled chamber without attacking the underlying crystalline metal to cause intergranular attack. Properly controlled by regulating the chamber temperature, the plasma reaction terminates when the plasma has removed the surface oxides and encounters the underlying crystalline metal. The product is a metal surface free of scale and alpha case and free of intergranular attack. The plasma descaling process replaces conventional metal finishing processes, such as chemical milling or etching.

REFERENCES:
patent: 5681486 (1997-10-01), Goode et al.
patent: 5843289 (1998-01-01), Lee et al.

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