Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2011-04-12
2011-04-12
Meeks, Timothy H (Department: 1715)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S248100
Reexamination Certificate
active
07923076
ABSTRACT:
A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle θ1of 0° to 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting apparatus is placed in the chamber and over the pedestal. The gas-extracting apparatus comprises a gas-extracting pipe providing a pumping path for particles and side-products having a pumping direction angle θ2of 0° to 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe.
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China Patent Office, Office Action, Patent Application Serial No. 200610126347.6, Jan. 24, 2011, China.
Chang Chia-Chiang
Liaw Shin-Chih
Lin Chun-Hung
Wu Chin-Jyi
Gambetta Kelly M
Industrial Technology Research Institute
Meeks Timothy H
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