Plasma contamination removal process

Details Plasma contamination removal process Plasma contamination removal process

1990-05-21

1993-03-30

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912144, 156646, 156345, B23K 900

Patent

active

051986345

ABSTRACT:
A unique process for the removal of organic polymer photoresist and contaminants from the surface of substrates such as semiconductor wafers is disclosed. The process uses a preferred operating power to pressure ratio (where power is measured in watts per cm.sup.3 of plasma and pressure in torr) of less than about 0.150. Pressures of from 10 to 50 torr, and power input of from 200 to 500 watts per cathode can be used to minimize radiation damage to the substrate, and avoid the necessity of using remotely generated plasmas. Additionally, the process minimizes device contamination by post-strip residues (organic and/or inorganic), since only a deionized water rinse is required. Processing time is also reduced.

REFERENCES:
patent: 3615956 (1971-10-01), Irving et al.
patent: 3705055 (1972-12-01), Christensen et al.
patent: 3837856 (1974-09-01), Irving et al.
patent: 3867216 (1975-02-01), Jacob
patent: 3879597 (1975-05-01), Bersin et al.
patent: 3951843 (1976-05-01), Jacob
patent: 4253907 (1981-03-01), Parry et al.
patent: 4304983 (1981-12-01), Pierfederici
patent: 4357203 (1982-11-01), Zelez
patent: 4370195 (1983-01-01), Halon et al.
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4443409 (1984-05-01), Saccocio et al.
patent: 4474621 (1984-10-01), Saccocio et al.
patent: 4529860 (1985-07-01), Robb
patent: 4540466 (1985-09-01), Nishizawa
patent: 4555303 (1985-11-01), Legge et al.
patent: 4673456 (1987-06-01), Spencer et al.
patent: 4687544 (1987-08-01), Bersin
patent: 4689112 (1987-08-01), Bersin
patent: 4699689 (1987-10-01), Bersin
patent: 4705595 (1987-11-01), Okudaira
patent: 4718974 (1988-01-01), Minaee
patent: 4718976 (1988-01-01), Fujimura
patent: 4736087 (1988-05-01), Whitlock et al.
patent: 4804431 (1989-02-01), Ribner
patent: 4812201 (1989-03-01), Sakai et al.
patent: 4836902 (1989-06-01), Kainitsky et al.

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