Plasma cleaning of deposition chamber residues using...

Details Plasma cleaning of deposition chamber residues using... Plasma cleaning of deposition chamber residues using...

2006-04-18

2006-04-18

Markoff, Alexander (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001000, C134S022100, C134S022180, C134S026000, C134S030000, C438S905000

Reexamination Certificate

active

07028696

ABSTRACT:
A method involving plasma cleaning of deposit residues in process chamber using duo-step wafer-less auto clean method is detailed. Specifically, the method involves cleaning the processing chamber by flowing a first gaseous composition with at least about 75% of fluorine-containing compound of the formula XyFz, into a processing chamber and then forming a first etchant plasma which removes silicon and silicon based byproducts from the interior surfaces of the processing chamber. The method then involves flowing a second gaseous composition into the processing chamber with a composition of at least about 50% O2and forming a plasma from the second gaseous composition to provide a second etchant plasma which removes carbon and carbon based byproducts from the interior surfaces of the processing chamber. A system configured to execute the two step cleaning process is also provided.

REFERENCES:
patent: 5620526 (1997-04-01), Watatani et al.
patent: 5647953 (1997-07-01), Williams et al.
patent: 5843239 (1998-12-01), Shrotriya
patent: 5846373 (1998-12-01), Pirkle et al.
patent: 5935340 (1999-08-01), Xia et al.
patent: 6125859 (2000-10-01), Kao et al.
patent: 0 933 803 (1999-08-01), None
patent: 0 933 806 (1999-08-01), None

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