Plasma cleaning gas with lower global warming potential than...

Cleaning and liquid contact with solids – Processes – Hollow work – internal surface treatment

Reexamination Certificate

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C134S001100, C134S031000, C134S902000, C216S064000, C216S067000, C438S905000

Reexamination Certificate

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06886573

ABSTRACT:
A process for cleaning a deposit from an interior surface of a processing chamber includes generating a plasma from a cleaning gas including SO2F2and contacting the interior surface with the plasma for a time sufficient to convert the deposit into a volatile product, thereby cleaning the deposit from the interior surface, in which the process is conducted in the absence of SF6. The deposits, which may be removed by the process of the invention, include silicone, silicone oxide, silicone nitride, tungsten, copper and aluminum.

REFERENCES:
patent: 4687543 (1987-08-01), Bowker
patent: 4975144 (1990-12-01), Yamazaki
patent: 5009963 (1991-04-01), Ohmi et al.
patent: 5114834 (1992-05-01), Nachshon et al.
patent: 5211790 (1993-05-01), Tatsumi
patent: 5217570 (1993-06-01), Kadomura
patent: 5227337 (1993-07-01), Kadomura
patent: 5228950 (1993-07-01), Webb et al.
patent: 5254176 (1993-10-01), Ibuka et al.
patent: 5310456 (1994-05-01), Kadomura
patent: 5312518 (1994-05-01), Kadomura
patent: 5314576 (1994-05-01), Kadomura
patent: 5326431 (1994-07-01), Kadomura
patent: 5354421 (1994-10-01), Tatsumi et al.
patent: 5360510 (1994-11-01), Kadomura
patent: 5368686 (1994-11-01), Tatsumi et al.
patent: 5376234 (1994-12-01), Yanagida
patent: 5378653 (1995-01-01), Yanagida
patent: 5445712 (1995-08-01), Yanagida
patent: 5507874 (1996-04-01), Su et al.
patent: 5565038 (1996-10-01), Ashley
patent: 5698070 (1997-12-01), Hirado et al.
patent: 5783492 (1998-07-01), Higuchi et al.
patent: 5817578 (1998-10-01), Ogawa
patent: 5855689 (1999-01-01), Akiyama
patent: 5868853 (1999-02-01), Chen et al.
patent: 6242359 (2001-06-01), Misra
patent: 6583065 (2003-06-01), Williams et al.
patent: 516053 (1999-02-01), None
patent: 1138802 (2001-10-01), None
patent: 2305940 (1997-04-01), None
patent: 2302165 (1990-12-01), None
patent: 4243129 (1992-08-01), None
patent: 4261017 (1992-09-01), None
patent: 136104 (1993-06-01), None
patent: 5558 (1994-01-01), None
patent: 104223 (1994-04-01), None
patent: 201819 (1995-08-01), None
patent: 134911 (1997-05-01), None
patent: 144792 (1998-05-01), None
patent: 0207194 (2002-01-01), None
“Applications of Plasma Processes to VLSI Technology,” T. Sugano, John Wiley & Sons, 1980, pp. 102-215.

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