Plasma chamber wall segment temperature control

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With heating or cooling means for apparatus part other than...

Reexamination Certificate

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Details

C156S345350, C118S7230AN, C118S7230MW, C118S724000

Reexamination Certificate

active

10765445

ABSTRACT:
A device and method for controlling the temperature of a plasma chamber inside wall or other surfaces exposed to the plasma by a plurality of temperature control systems. A plasma process within the plasma chamber can be controlled by independently controlling the temperature of segments of the wall or other surfaces.

REFERENCES:
patent: 5477975 (1995-12-01), Rice et al.
patent: 6113732 (2000-09-01), Yoshida et al.
patent: 0 838 841 (1998-04-01), None
patent: WO 99/25494 (1999-05-01), None

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