Planarizing and testing of BGA packages

Details Planarizing and testing of BGA packages Planarizing and testing of BGA packages

2005-12-13

2005-12-13

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090, C324S761010

Reexamination Certificate

active

06975127

ABSTRACT:
The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts for package testing. After testing, the package has external terminals with improved planarity that improves the electrical connections formed during assembly of a system containing the package.

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