Planarized local oxidation by trench-around technology

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257513, 257519, 257635, 257638, H01L 2900, H01L 2358

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active

054650038

ABSTRACT:
A new planarized device isolation structure within a semiconductor substrate is described. The device isolation structure comprises narrow device isolation regions each consisting of a deep trench having a thin oxide covering its sidewalls and bottom and filled with silicon oxide, wide device isolation regions each consisting of two deep trenches flanking a shallow trench wherein each deep trench has a thin oxide covering its sidewalls and bottom and is filled with silicon oxide and wherein the shallow trench is filled with a field oxide. The top surface of the narrow and wide device isolation regions and the semiconductor substrate is planarized.

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